Top Required Skills
1. Microelectronics background (electrical engineering degree)
2. Hands on able to work in lab bench equipment
3. Trouble shooting - systematically diagnosing fail signature by correlating electrical test data from multiple sources and fault isolation.
Qualifications:
2+ years of chip or wafer-level Failure Analysis (e.g., physical failure analysis, electrical microscopy, nanoprobing) experience or related work experience.
• Applies knowledge of failure analysis (e.g., physical/electrical failure analysis, etc.) to determine the cause of failure by evaluating electrical and mechanical characteristics of systems and/or integrated circuits, components, and sub-components.
• Administers non-destructive testing on devices using imaging tools (e.g., X-ray, C-SAM) and/or optical inspections.
• Performs failure analyses on issues (e.g., level 2) requiring creative problem solving.
Required Education & Required Years of Experience
Bachelor's degree or equivalent in Science, Engineering, or related field and 2+ years of chip or wafer-level Failure Analysis (e.g., physical/electrical failure analysis) or related work experience. .
OR
Master's degree in Science, Engineering, or related field and 1+ year of chip or wafer-level Failure Analysis (e.g., physical/electrical failure analysis) or related work experience.