IC Packaging Lead – Mountain View
Acceler8 Talent is seeking a Packaging Design Lead to join an exciting and well-funded AI hardware start-up that is developing a new class of network hardware to drastically reduce the cost of running AI workloads.
As an Packaging Lead you will lead the planning, analysis, and integration of advanced packaging solutions for a new category of product that will revolutionize next-gen AI computation.
Requirements
- MS or PhD in EE or MechE, plus 10+ years of experience
- Hands on experience leading large body size, high power, high speed substrate design using Cadence APD/SIP/Xpedition
- Strong understanding of SI/PI, Ansys HFSS, and SiWave.
- Good knowledge of package and PCB materials and material properties.
- Experience with 2.5D packaging and interposer integration
- Proven track record driving substrate layout engineering teams.
- Direct experience with production qualification and post-production activities.
They are looking for someone to start right away and are offering $250k-$280k base with a generous equity package.
Please apply here or contact Luke at ltomaszko@acceler8talent.com to hear more.
