Acceler8Talent is seeking an IC Packaging Design Engineer for a well-funded Series A ML/AI semiconductor startup to help lead the design and implementation of next generation optical modules for high performance compute applications.
They are creating optics significantly more dense, scalable and lower power than existing solutions, breaking the I/O wall in data centers and enabling more advanced compute, AI and machine learning.
The ideal candidate will have a strong background in mechanical/electrical engineering with a focus on packaging technologies for semiconductor devices including mixed-signal and photonic ICs.
Fulltime role in New Jersey (can specific city in initial conversation).
Job Requirements
- BS in Mechanical Engineering.
- 2+ years hands on experience with IC package design.
- Organized with excellent written and verbal communication skills.
All candidates must be authorized to work in the United States