IC Design Engineer (RF/Mixed-Signal)
$100,000 - $150,000 + Considerable stock + Large performance-based bonuses + Benefits
On-site - Indianapolis, Indiana
Are you a PhD grad and/or experienced chip designer with tapeout experience?
Fantastic opportunity to join an AI tech start-up that is at the forefront of brain-inspired wearable computing, giving you the opportunity to work on groundbreaking technology that the world has not yet seen in addition to mentoring and growing your own team!
This exciting on-site opportunity is based in West Lafayette, home of the famed Purdue University, with a rapidly growing startup! This is a rare opportunity to work with leaders in IC/system design on a product that has never been seen before to revolutionize human-computer interfaces with AI.
As a Staff Engineer, you’ll play an essential role in designing the RF and mixed-signal ICs that will power this truly innovative technology.
If you are a self-starter with experience with chip tapeout and the ambition to change the future of wearable technology, this could well be the opportunity you have been looking for!
The Role
- Design and analyze analog-mixed circuits with a focus on wireless communications.
- Integrate analog IPs into SOCs and perform related verification tasks.
- Manage the design and tapeout process for RF ICs, overseeing the entire design life cycle.
- Recruit, mentor, and develop junior and experienced engineers.
- Utilize circuit design software tools effectively
The Person
- PhD or extensive experience with chip tapeout and RF/mixed-signal IC design
- Published papers in ISSCC
- Strong board-level and firmware debugging skills
- Extensive technical knowledge with a quick learning ability
- Proficiency in PCB Design software tools
If this sounds like you, please don’t hesitate to apply now!
