Thank your for your interested in this Failure Analysis Position.
This position is a hardware position related to micro-electronics NOT for software.
We are looking for people familiar with failure analysis who loves to be very hands on and able to communicate well across many diciplines.
If you the below sparks interest please read on and get in touch!
Responsibilities
- IC package de-capping, die/pry and laser etching.
-Experience with flexible electronics (e.g. flexible substrates), flip-chip techniques, underfill, photo-paternable resins and conductors.
- Conduct method development for electrical fault isolation of component level electronics via TDR, Laser-Thermal (XIVA/OBRICH), magnetic current imaging (MCI), lock-in thermography (LIT).
-Metallic materials characterization techniques including EBSD-KAM (sample preparation and imaging), grain/phase analysis, structure-property relationship, fractography, XRD/XRF, metallographic cross sectioning and ion-milling and general materials characterization including surface profilometry, mechanical testing, and nano-indentation
- Follow and develop protocols and methodologies for metallurgical sample preparation including potting/cross-sectioning/polishing, dye/pry, de-capping, and plasma etching
- Analyze circuits and topologies to identify marginal failure root causes
Minimum Qualifications
- Bachelor's Degree in ME/EE/Metallurgy or related technical field or equivalent experience
- Experience in Failure Analysis techniques for micro-electronics is a MUST.
- Good understanding of integrated electronics microfab is a MUST to ensure that the job can be performed.
-2+ years experience on the following:
XIVA - Externally Induce Voltage Alteration
OBIRCH - Optical beam induced resistance change
MCI - Magnetic Current Imaging
LIT - Lock-in IR thermography (OR FTIR)
TDR - Time domain reflectometry( OR trace probing on integrated electronic devices)
EBSD- Electrom beam backscattered diffraction
X-ray diffraction (XRD) and X-ray fluorescence (XRF)
C-SAM - Scanning Acustic Microscopy
SEM - Scanning Electron Scanning.
Variaty of thermal Analysis tools and techniques (DSC/TGA/TMA)
- 2+ years of experience in metallurgical cross-sectioning, de-capping, ion milling, dye/pry
- 1+ years’ experience in non-metallic materials characterization including Intron/FTIR/DSC/TGA/TMA
- Ability to read schematics, bill of materials (BOMs), and understand PCB layout, and component level data sheets
Desired Qualifications
- Knowledge of integrated electronics fabrication processes and experience with electro-mechanical systems assembly
- 5+ years experience in analytical and FA techniques, including all listed above.
- 5+ Experience with materials relevant to flexible electronic devices, i.e. photopatternable polymeric resins, elastomers, conductors, underfills, encapsulant materials, thermal materialsnt verbal and written communication skills
Additional Details
Benefit Conditions: Only full-time employees eligible
Benefits: Dental insurance, Health insurance, Paid time off (Vac.& Sick), Relocation assistance, Tuition reimbursement, Health Insurance, Bonus pay
