Duties and Responsibilities

Install and qualify ASMPT’s Proprietary Semiconductor Equipment for high precision interconnection technology for different semiconductor applications.
Analyze, interpret and make critical decision on process and equipment related issues.
Leading and participating in complex service calls and interfacing with customers personnel to provide quality service and feedback on problem evaluation and resolution.
Provides expert advice, training, and technical assistance to support both external and internal customers as needed
Support machine FAT and SAT activities as defined by our customers.
Understanding customer requirements to ensure system meets requirements and generate new business opportunities.
Submits on time reports required. & perform other duties as assigned.

Education and Experience Requirements

Bachelor's Degree in Materials, Mechanics, Chemistry, Physics or Microelectronics with a minimum of 1 - 2 years' experience in IC Packaging and Assembly related equipment

Note: Only candidates with a bachelor's degree as a minimum or AS Degree with a minimum 4-year Semiconductor Microelectronics or Automation experience will be considered

Other Requirements

Must be willing to travel up to 70% of the time. Travel includes both International and Domestic
Legally authorized to work in the US and able to travel overseas.
Must be able to work with minimal supervision.
Good written and oral communication and interpersonal skills
Must be fluent in English, both written and spoken, intermediate to advanced Spanish language skills a plus
Ability to logically troubleshoot complex hardware, software, application, and process related issues an convey this information in a way the customer understands
Proficient in Microsoft Office programs.
Knowledge and experience in Wire Bonding system and process.

ASMPT SEMI USA INC.

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