Duties and Responsibilities
- Install and qualify ASMPT’s Proprietary Semiconductor Equipment for high precision interconnection technology for different semiconductor applications.
- Analyze, interpret and make critical decision on process and equipment related issues.
- Leading and participating in complex service calls and interfacing with customers personnel to provide quality service and feedback on problem evaluation and resolution.
- Provides expert advice, training, and technical assistance to support both external and internal customers as needed
- Support machine FAT and SAT activities as defined by our customers.
- Understanding customer requirements to ensure system meets requirements and generate new business opportunities.
- Submits on time reports required. & perform other duties as assigned.
Education and Experience Requirements
- Bachelor's Degree in Materials, Mechanics, Chemistry, Physics or Microelectronics with a minimum of 1 - 2 years' experience in IC Packaging and Assembly related equipment
Note: Only candidates with a bachelor's degree as a minimum or AS Degree with a minimum 4-year Semiconductor Microelectronics or Automation experience will be considered
Other Requirements
- Must be willing to travel up to 70% of the time. Travel includes both International and Domestic
- Legally authorized to work in the US and able to travel overseas.
- Must be able to work with minimal supervision.
- Good written and oral communication and interpersonal skills
- Must be fluent in English, both written and spoken, intermediate to advanced Spanish language skills a plus
- Ability to logically troubleshoot complex hardware, software, application, and process related issues an convey this information in a way the customer understands
- Proficient in Microsoft Office programs.
- Knowledge and experience in Wire Bonding system and process.
