DUTIES/RESPONSIBILITIES:
- Manage the lithography process and technology
- Develop and implement strategies to optimize plating processes, improve efficiency, and meet production targets
- Maintain and support process optimization based on the knowledge of ABF/glass/PR & DFR materials
- Develop and maintain documentation including standard operating procedures (SOPS), work instructions, and process specifications
- Perform statistical process control tasks using statistical tools
REQUIREMENTS:
- Strong technical expertise in lithography equipment, processes, and photosensitive materials
- In-depth technical knowledge of relevant process and industry
- Proven track record of leadership and management in a substrate for semiconductor manufacturing
- Ability to work well in a team environment.
QUALITIFICATIONS:
- In-depth technical knowledge of relevant process and industry
- Effective communication skills and ability to collaborate with colleagues.
- Must be at least 18 years old and authorized to work in the United States
EDUCATION:
· Bachelor’s degree or higher in engineering or science (material science and engineering, chemical engineering, or chemistry)
EXPERIENCE:
- 5 + years of experience in the industry with a focus on PI passivation and coating process.
